3M Diamond Slurries, Compounds, Minerals, Lapping Film, DIAMOND
COMPOUND 6-H-UBS 18 GRAM SYRINGE WENDT 174182

3M Products & Supplies

3M Diamond Slurries, Compounds, Minerals, Lapping Film, DIAMOND COMPOUND 6-H-UBS 18 GRAM SYRINGE WENDT 174182

Name: 3M Diamond Slurries, Compounds, Minerals, Lapping Film, DIAMOND COMPOUND 6-H-UBS 18 GRAM SYRINGE WENDT 174182
Brand: 3M Products & Supplies
SKU: 7010482392
Price: 225.54 USD
Availability: InStock

SKU: 7010482392

MPN: 7010482392

Lead Time: 10 working days.

UPC: 00051125754927

3M ID: 65300002311

5 Digit UPC: 75492

Manufacturer: 3M

Shelf Life: 547 Days

Country of Origin: USA

Abrasive Material: Diamond

$225.54 each

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Product Description
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Product Description

Experience superior precision and exceptional finish with 3M Diamond Slurries and Compounds. Perfectly engineered for high-quality lapping applications, these advanced diamond compounds cultivate a flawless surface that meets stringent industry standards.

The 3M Diamond Compound 6-H-UBS, delivered in a convenient 18-gram syringe, is designed for precise application even on the most delicate surfaces. Crafted with advanced diamond particles, this compound is ideal for lapping metals, ceramics, and composite materials, ensuring unmatched performance and durability.

High-quality diamond particles provide a superior grind, enhancing the efficiency of lapping processes.
Convenient syringe design allows for easy application and minimizes waste.
Compatible with a wide range of substrates, making it versatile for various industrial applications.
Formulated to deliver a high gloss finish, reducing the need for additional polishing.
Engineered for prolonged stability, ensuring consistency and reliability throughout your projects.

Trust 3M for your precision lapping needs. With our Diamond Compound, you combine the reliability of industry-leading technology with the ease of use that professionals demand. Elevate your production capabilities and achieve exceptional results in your machining and finishing applications.