3M Products & Supplies
3M™ Diamond Lapping Film 662XW, 1.5 micron, 3 mil, TH DC, 4.375 in - 7100166907
3M™ Diamond Lapping Film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over our standard diamond lapping film. Available in 0.50, 1.0, 1.50, 3.0, 6.0 and 9.0 micron grades.
Features
Downloads
| Country of Origin | United States |
|---|---|
| Abrasive Material | Diamond |
| Backing Thickness (Metric) | 0.076 |
| Micron Grade | 0.5 μm |
| Center Hole Diameter (Imperial) | 0.0 |
| Overall Length (Metric) | 0.0 |
| Application | Flat Lapping; Polishing; Superfinishing |
| Backing Thickness (Imperial) | 3.0 |
| Overall Diameter (Metric) | 0.0 |
| Overall Width (Metric) | 111.125 |
| Overall Width (Metric) UOM | mm |
| Product Usage | Fiber Optic Connectors |
| Center Hole Diameter (Metric) | 0.0 |
| Overall Width (Imperial) UOM | in |
| Product Series | 662XW |
| Overall Length (Imperial) | 0.0 |
| Backing Thickness (Metric) UOM | mm |
| Backing Thickness (Imperial) UOM | mil |
| Overall Diameter (Imperial) | 0.0 |
| Overall Width (Imperial) | 4.375 |
| Attachment Type | Plain Back |
| Backing Material | Polyester Film |
| Product Color | White |
| Substrate | Carbide; Ceramic; Composite; Exotic Alloy; Glass; Hardened Metal; Quartz; Sapphire; Stone |