3M Products & Supplies
3M™ Diamond Lapping Film 662XW Type H, 3.0 Micron Disc, 5 in x NH Die# 500X, 25/Inner, 250/Case, Telcom - 7010365190
3M™ Diamond Lapping Film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over our standard diamond lapping film. Available in 0.50, 1.0, 1.50, 3.0, 6.0 and 9.0 micron grades.
Features
Downloads
| Country of Origin | United States |
|---|---|
| Product Series | 662XW |
| Overall Diameter (Imperial) UOM | in |
| Overall Length (Metric) | 0.0 |
| Backing Material | Polyester Film |
| Product Color | Lavender |
| Center Hole Diameter (Imperial) | 0.0 |
| Overall Width (Metric) | 0.0 |
| Application | Flat Lapping; Polishing; Superfinishing |
| Attachment Type | Plain Back |
| Substrate | Stone |
| Product Usage | Fiber Optic Connectors |
| Overall Diameter (Metric) UOM | mm |
| Abrasive Material | Diamond |
| Backing Thickness (Imperial) | 3.0 |
| Backing Thickness (Metric) | 0.076 |
| Micron Grade | 1 μm |
| Overall Diameter (Imperial) | 5.0 |
| Product Form | Disc |
| Backing Thickness (Metric) UOM | mm |
| Backing Thickness (Imperial) UOM | mil |
| Center Hole Diameter (Metric) | 0.0 |
| Overall Diameter (Metric) | 127.0 |
| Overall Width (Imperial) | 0.0 |
| Overall Length (Imperial) | 0.0 |