primary_image
alternate_image
primary_image
alternate_image
primary_image
alternate_image
Previous Next

3M Products & Supplies

3M™ Diamond Lapping Film 662XW Type H, 3.0 Micron Disc, 5 in x NH Die# 500X, 25/Inner, 250/Case, Telcom - 7010365190

Sold As: 250-Pack
SKU: 7010365190
MPN: 7010365190
Made to Order: For a lead time estimate, please send your request to [email protected]
UPC: 00051144863303
3M ID: 60650025699
5 Digit UPC: 86330
$1,504.99 ($6.02 / Count)
Hurry up! Current stock:

Product Description

3M™ Diamond Lapping Film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over our standard diamond lapping film. Available in 0.50, 1.0, 1.50, 3.0, 6.0 and 9.0 micron grades.

Features

  • Good finish
  • Long abrasive life minimizes disc changes
  • Increased throughput
  • A higher diamond concentration and a stronger resin bond give this product added durability and increased cut rate over our standard diamond lapping film
  • Available in discs, rolls and sheets
  • Flat surface, no rounding
Spec Sheet

 

Downloads

Specifications

Country of OriginUnited States
Product ColorPink
Overall Length (Metric)0.0
Overall Width (Metric)0.0
Product Series662XW
Backing Thickness (Metric) UOMmm
Backing Thickness (Metric)0.076
Backing MaterialPolyester Film
Product FormDisc
SubstrateStone
Overall Width (Imperial)0.0
Overall Diameter (Imperial) UOMin
Attachment TypePlain Back
Micron Grade3 μm
ApplicationFlat Lapping; Polishing; Superfinishing
Overall Diameter (Metric) UOMmm
Center Hole Diameter (Imperial)0.0
Product UsageFiber Optic Connectors
Overall Diameter (Metric)127.0
Backing Thickness (Imperial)3.0
Center Hole Diameter (Metric)0.0
Abrasive MaterialDiamond
Overall Length (Imperial)0.0
Backing Thickness (Imperial) UOMmil
Overall Diameter (Imperial)5.0

Customers Also Viewed