3M Products & Supplies
3M™ Electrically Conductive Double-Sided Tape 5113DFT-50, Grey, 25 mm x 30 m, 8 Rolls/Case - 7100313601
3M™ Electrically Conductive Double-Sided Tape 5113DFT is an electrically conductive double-sided fabric tape (DFT) that provides high adhesion, low electrical resistance, long shelf life, resistance to high temperature and humidity and excellent grounding and shielding performance. It features a proprietary polyolefin XYZ-axis conductive pressure sensitive adhesive (CPSA) and a conductive matrix carrier (a nickel/copper/nickel-coated conductive woven carrier). This grounding tape provides excellent adhesion to a variety of substrates including metals and plastics and helps control signal interference through passive intermodulation (PIM) mitigation for higher signal integrity and performance. This double-sided fabric tape helps protect against EMI in a range of market segments, including general industrial electronics, aerospace and defense electronics, appliances, automotive electronics and IoT devices, communications infrastructure, and medical equipment.
Features
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| Shelf Life | 48.0 Month |
|---|---|
| Country of Origin | China |
| Total Tape Thickness without Liner (Metric) | 0.05 |
| Overall Length (Metric) UOM | m |
| Maximum Operating Temperature (Fahrenheit) | 250.0 Degree Fahrenheit |
| Adhesive Type | Polyolefin |
| Product Color | Gray |
| Overall Length (Metric) | 30.0 |
| Overall Width (Imperial) | 1.969 |
| Total Tape Thickness without Liner (Imperial) | 2.0 |
| Overall Length (Imperial) UOM | yd |
| Minimum Operating Temperature (Fahrenheit) | -40.0 Degree Fahrenheit |
| Minimum Operating Temperature (Celsius) | -40.0 Degree Celsius |
| Total Tape Thickness without Liner (Metric) UOM | mm |
| Overall Width (Metric) | 50.0 |
| Electrical Resistance | XY-axis 0.01 Ω, Z-axis 0.03 Ω |
| Overall Width (Metric) UOM | mm |
| Overall Width (Imperial) UOM | in |
| Maximum Operating Temperature (Celsius) | 121.0 Degree Celsius |
| Overall Length (Imperial) | 32.808 |
| Application | Attaching; Electrostatic Discharge (ESD); Grounding; Interconnecting; Passive Intermodulation (PIM) Management |
| Adhesion Strength (Imperial) | 1500.0 |
| Backing (Carrier) Material | Woven Fabric |
| Product Usage | Bond Line Gaps; Chassis; EMI Gaskets; EMI Shields; Flexible Printed Circuits; Printed Circuit Boards; Sensors |
| Total Tape Thickness without Liner (Imperial) UOM | mil |
| Liner Material | PET |