3M™ Trizact™ Diamond Pad Conditioner 678XATD2R, 15.84mm x 33m x 75mm core or 0.625in x 110ft x 3in core - 7100198867
3M™ Trizact™ Diamond Pad Conditioner 678XATD2R, 15.84mm x 33m x 75mm core or 0.625in x 110ft x 3in core - 7100198867
3M™ Trizact™ Diamond Pad Conditioner 678XATD2R, 15.84mm x 33m x 75mm core or 0.625in x 110ft x 3in core - 7100198867
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3M™ Trizact™ Diamond Pad Conditioner 678XATD2R, 15.84mm x 33m x 75mm core or 0.625in x 110ft x 3in core - 7100198867

SKU: 7100198867
MPN: 7100198867
Made to Order: For a lead time estimate, please send your request to [email protected]
UPC: 00051111904220
3M ID: 60000336945
5 Digit UPC: 90422
$2,004.93 each
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Product Description

3M™ Trizact™ Pad Conditioner delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). The diamond-coated ceramic construction on 3M™ Trizact™ Pad Conditioner is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives. It has a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.

Features

  • 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
  • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
  • Metal-free cutting surface for advanced node processes sensitive to metal contamination
  • Outstanding disk-to-disk consistency for predictive performance
  • Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
  • Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination
Spec Sheet

 

Downloads

Specifications

Country of OriginUnited States
Carrier FormDisc
Carrier Width (Metric)0.0
Carrier Diameter (Imperial)0.0
Carrier Length (Metric)0.0
CMP ProcessAll
Carrier Width (Imperial)0.0
Carrier MaterialStainless Steel
Carrier Diameter (Metric)0.0
Diamond Size0.0
ApplicationAdvanced Node (Memory & Logic); CMP; Wafer Manufacturing
Carrier Length (Imperial)0.0
Abrasive MaterialCVD coated ceramic
Product TypePad Conditioner

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