3M Products & Supplies

3M™ Wafer De-Taping Tape 3305, 25 mm x 100 m - 7010321285

Sold As: 40-Pack
SKU: 7010321285
MPN: 7010321285
Made to Order: For a lead time estimate, please send your request to [email protected]
UPC: 04548623422213
3M ID: JT200085234
5 Digit UPC: 42221
$1,534.48 ($38.36 / Count)
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Product Description

3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

Features

  • Transparency allows for inspection without tape removal
  • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
  • Good holding power
  • High instant adhesion to substrate
Spec Sheet

 

Downloads

Specifications

Country of OriginJapan
Overall Width (Metric) UOMmm
Product ColorGreen
Backing (Carrier) MaterialPolyester
Adhesive TypeSilicone
Elongation at Break125%
Overall Width (Metric)25.0
Overall Length (Imperial) UOMyd
Overall Length (Metric) UOMm
Overall Width (Imperial)2.165
Overall Width (Imperial) UOMin
Overall Length (Imperial)109.361
Overall Length (Metric)100.0

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