primary_image
primary_image
primary_image
Previous Next

3M Products & Supplies

3M™ Wafer De-Taping Tape 3305, 210 mm x 100 m, 4/Case - 7100079058

Sold As: 4-Pack
SKU: 7100079058
MPN: 7100079058
Made to Order: For a lead time estimate, please send your request to [email protected]
UPC: 00051141415277
3M ID: JT200085515
$1,176.53 ($294.13 / Count)
Hurry up! Current stock:

Product Description

3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

Features

  • Transparency allows for inspection without tape removal
  • High instant adhesion to substrate
  • Good holding power
  • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding

Downloads

Specifications

Overall Length (Metric) UOMm
Overall Width (Metric) UOMmm
Backing (Carrier) MaterialPolyester
Product ColorTransparent
Overall Length (Imperial) UOMyd
Overall Width (Imperial)8.27
Adhesive TypeRubber Resin
Total Tape Thickness without Liner (Imperial)2.68
Overall Width (Imperial) UOMin
Country of OriginJapan
Total Tape Thickness without Liner (Imperial) UOMmil
Overall Length (Imperial)109.361
Elongation at Break125%
Overall Length (Metric)100.0
Total Tape Thickness without Liner (Metric) UOMMicron
Total Tape Thickness without Liner (Metric)68.0
Overall Width (Metric)210.0

Customers Also Viewed