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3M Products & Supplies

3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105, Black, 30cc Syringe, 20 Each/Case - 7100350802

Sold As: 480-Pack
SKU: 7100350802
MPN: 7100350802
Made to Order: For a lead time estimate, please send your request to [email protected]
UPC: 08887862983557
3M ID: UU013294093
$27,330.47 ($56.94 / Count)
Hurry up! Current stock:

Product Description

3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105 is a one-part epoxy engineered for nearly endless design possibilities for consumer electronics. This is made possible through its unique adhesive properties, which include very low-temperature (55 °C) curing in order to bond to or near heat-sensitive substrates — while still offering fast, high-temperature (90–120 °C) curing when needed. It can be used for bonding dissimilar materials and electronic-grade plastics, ensuring low shrinkage, good impact resistance, and a low dielectric constant (Dk). Smartphones, tablets, wearable devices — unlock true design freedom with 3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105.

Features

  • MULTI‑MATERIAL PERFORMANCE: Helps to bond dissimilar materials and electronic‑grade plastics with low shrinkage and good impact resistance
  • EASY TO DISPENSE: Flowable rheology supports dispensing across varied application techniques, including bead dispensing, jetting, screen or stencil printing, and molding
  • REDUCED SIGNAL LOSS: Delivers a low dielectric constant (Dk), making it suitable for applications where reduced signal delay and crosstalk are needed
  • ONE-PART SIMPLICITY: Eliminates the need for mixing and nozzle changes, allowing small‑batch builds and minor dispensing adjustments with less material waste
  • ELECTRONICS READY: Engineered to unlock design innovation for consumer electronics, such as smartphones, tablets, and wearable devices
  • LOW‑TEMP CURE: Supports bonding to or near heat‑sensitive substrates by curing at 55 °C while still enabling faster, higher‑temperature (90–120 °C) cures when needed
Spec Sheet

 

Downloads

Specifications

Shelf Life365
Adhesive TypeOne-part Epoxy
Shelf Life UOMMonth
Container Size (Metric)30.0 ml
ApplicationComposite Bonding; Impact Resistance; Large Surface Lamination Assembly; Metal Bonding; Metal to Composite Bonding; Sealing, Potting and Encapsulating; Small Joint Assembly; Structural Bonding; Thin Metal Stack Laminations
Country of OriginSingapore
Density1.08
Container Size (Imperial)1.014 fl oz (US)
IndustriesElectronics
Shear Strength3916.0
Shear Strength UOMpsi
Bond FlexibilityRigid
Full Cure Time20 min @ 149 °F (65 °C)
Physical FormLiquid
Indoor/OutdoorIndoor/Outdoor
Units per Case20.0
Adhesion Strength3916.0

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