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3M Products & Supplies

3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105, Black, 55cc Syringe, 20 Each/Case - 7100350853

Sold As: 480-Pack
SKU: 7100350853
MPN: 7100350853
Made to Order: For a lead time estimate, please send your request to [email protected]
UPC: 08887862983564
3M ID: UU013294101
$42,586.46 ($88.72 / Count)
Hurry up! Current stock:

Product Description

3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105 is a one-part epoxy engineered for nearly endless design possibilities for consumer electronics. This is made possible through its unique adhesive properties, which include very low-temperature (55 °C) curing in order to bond to or near heat-sensitive substrates — while still offering fast, high-temperature (90–120 °C) curing when needed. It can be used for bonding dissimilar materials and electronic-grade plastics, ensuring low shrinkage, good impact resistance, and a low dielectric constant (Dk). Smartphones, tablets, wearable devices — unlock true design freedom with 3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105.

Features

  • MULTI‑MATERIAL PERFORMANCE: Helps to bond dissimilar materials and electronic‑grade plastics with low shrinkage and good impact resistance
  • ONE-PART SIMPLICITY: Eliminates the need for mixing and nozzle changes, allowing small‑batch builds and minor dispensing adjustments with less material waste
  • LOW‑TEMP CURE: Supports bonding to or near heat‑sensitive substrates by curing at 55 °C while still enabling faster, higher‑temperature (90–120 °C) cures when needed
  • ELECTRONICS READY: Engineered to unlock design innovation for consumer electronics, such as smartphones, tablets, and wearable devices
  • EASY TO DISPENSE: Flowable rheology supports dispensing across varied application techniques, including bead dispensing, jetting, screen or stencil printing, and molding
  • REDUCED SIGNAL LOSS: Delivers a low dielectric constant (Dk), making it suitable for applications where reduced signal delay and crosstalk are needed
Spec Sheet

 

Downloads

Specifications

Shelf Life365
Full Cure Time20 min @ 149 °F (65 °C)
ApplicationComposite Bonding; Impact Resistance; Large Surface Lamination Assembly; Metal Bonding; Metal to Composite Bonding; Sealing, Potting and Encapsulating; Small Joint Assembly; Structural Bonding; Thin Metal Stack Laminations
Units per Case20.0
Country of OriginSingapore
Adhesion Strength3916.0
Shear Strength UOMpsi
Density1.08
Bond FlexibilityRigid
Shelf Life UOMMonth
IndustriesElectronics
Container Size (Imperial)1.86 fl oz (US)
Physical FormLiquid
Indoor/OutdoorIndoor/Outdoor
Adhesive TypeOne-part Epoxy
Shear Strength3916.0
Container Size (Metric)55.0 ml

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