3M Thermally Conductive Acrylic Interface Pad 5570N is designed to provide a preferential heat transfer path between heat generating components like integrated circuit chips and heat spreaders like aluminum heat sinks.
3M Thermally Conductive Acrylic Interface Pad 5570N is designed to provide a preferential heat transfer path between heat generating components like integrated circuit chips and heat spreaders like...
3M Thermally Conductive Acrylic Interface Pad 5570N is designed to provide a preferential heat transfer path between heat generating components like integrated circuit chips and heat spreaders like...
3M Thermally Conductive Acrylic Interface Pad 5550H is a highly conformable and ultra-soft pad with high thermal conductivity of 3.0 W/m-K (3M test method). This pad consists of a slightly tacky...
3M Thermally Conductive Acrylic Interface Pad 5571N is 0.5 mm thick and designated to provide a preferential heat transfer path between heat generating components like integrated circuit chip and...
3M Thermally Conductive Silicone Interface Pad 5584 is a soft, silicone elastomer with thermal conductivity of 1.1 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps...