3M Thermally Conductive Acrylic Interface Pad 5571N is 0.5 mm thick and designated to provide a preferential heat transfer path between heat generating components like integrated circuit chip and heat spreaders as aluminum heat sink.
3M Thermally Conductive Acrylic Interface Pad 5570N is designed to provide a preferential heat transfer path between heat generating components like integrated circuit chips and heat spreaders like...
3M Thermally Conductive Acrylic Interface Pad 5570N is designed to provide a preferential heat transfer path between heat generating components like integrated circuit chips and heat spreaders like...
3M Thermally Conductive Acrylic Interface Pad 5550H is a highly conformable and ultra-soft pad with high thermal conductivity of 3.0 W/m-K (3M test method). This pad consists of a slightly tacky...
3M Thermally Conductive Acrylic Interface Pad 5571 is designated to provide a preferential heat transfer path between heat generating components like integrated circuit chip and heat spreaders as...
3M Thermally Conductive Acrylic Interface Pad 5570N is designed to provide a preferential heat transfer path between heat generating components like integrated circuit chips and heat spreaders like...